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SF215C

特点

●透明度低,遮光性佳。

●阻燃性达到UL94 V-0级。

●优秀的耐热性、耐化学性和电性能。

●溢胶量低,加工性好,适于快速压合和传统压合。

●满足RoHS指令要求,不含铅、汞、镉、六价铬、多溴联苯、多溴联苯醚等。

应用领域

挠性印制电路板用覆盖膜
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Items Method Condition Unit Typical Value
Peel Strength (90°)* IPC-TM-650 2.4.9D Accepted N/mm 0.71
288℃, 5s 0.7
Solder Resistance IPC-TM-650 2.4.13.F 288℃, 10s - No delamination
Dimensional Stability SY Method After peeling off the paper
% -0.0304/-0.0151
Chemical Resistance IPC-TM-650 2.3.2G After Chemical Exposure % >85
Volume Resistivity IPC-TM-650 2.5.17E C-96/35/90 MΩ-cm 4.1×108
Surface Resistance IPC-TM-650 2.5.17E C-96/35/90
1.2×105
Dielectric Constant (10GHz) SPDR C-24/23/50 - 4.22
Dissipation Factor (10GMHz) SPDR C-24/23/50
- 0.0405
Resin Flow IPC-TM-650 2.3.17.1 180℃/10+60s,100kg/cm2
mm <0.15
Flammability UL94 E-24/125
Rating V-0

Remarks:

 * Certified to IPC-4203/2 Epoxy adhesiveon one or two sides of poyimide dielectric
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